Backplane connectors combine speed, density

Molex Incorporated recently released the Impact? 100-Ohm backplane connector, which combines speed and density in a modular package designed for high speed applications.  The scalable Impact connector technology provides data rates up to 25 Gbps with excellent signal density up to 80 differential pairs per linear inch when using a 6-pair configuration.

Designed to meet the requirements of next-generation applications, the Impact backplane connector is suitable for high speed networking equipment and storage servers in the data and telecommunications, medical, military and aerospace industries.  The Impact backplane connector conforms to IEEE 10GBASE-KR and OIF Stat Eye Compliant end-to-end channel performance.

Featuring an easy-to-manage 1.90 by 1.35mm grid, which reduces PCB routing complexity and cost, the broad-edge coupled, differential-pair Impact backplane system supports high bandwidth needs while minimizing board and system real estate usage.  Compliant pin attach options (0.39 and 0.46mm) provide the flexibility to optimize designs for superior mechanical and electrical performance in traditional backplane or midplane architectures.  The Impact daughtercard mating interface utilizes an in-line staggered, bifurcated contact system that reduces the mating force per pin and provides ground-signal sequencing without the need for multiple backplane signal-pin heights. 

Available in conventional, coplanar, mezzanine, orthogonal and orthogonal direct configurations, the Impact Backplane family provides best-in-class versatility.  The Impact signal module options vary by configuration and are offered in 2 through 6 pairs.  The Impact power modules are offered in 3 through 6 pair sizes in conventional, coplanar and mezzanine configurations with current ratings from 60.0 to 120.0A per module.

Molex Incorporated
www.molex.com

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