SO-4
- 商品画像 & モデル
- 備考
- 単価
- 量
- 動作して
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Transistor Output Optocouplers 50mA Photocoupler 80V 3750Vrms
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 12
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NECs HIGH CTR, 4 PIN ULTRA SMALL PACKAGE FLAT LEAD OPTOCOUPLER,Transistor Output Optocouplers High CTR 1-Ch
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 208
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1Channel AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER, ROHS COMPLIANT, SMD, MINIFLAT, SOP-4
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 30000
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Lead Free General Purpose Phototransistor Optocoupler,Transistor Output Optocouplers 3750 Vrms 20% CTR
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 410
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Lead Free General Purpose Phototransistor Optocoupler,Transistor Output Optocouplers 3750 Vrms 0.2mA
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 400
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GLASS PASSIVATED SUPER FAST SILICON SURFACE MOUNT BRIDGE RECTIFIER (VOLTAGE RANGE 50 to 400 Volts CURRENT 1.0 Ampere)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 1289000
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Ceramic Chip Capacitors / Standard X7R; Capacitance [nom]: 10uF; Working Voltage (Vdc)[max]: 10V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1210; Term
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 4000
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Standard, 1 Form A, Solid State Relay (Photo MOSFET), 400V/0.1A/35Ω,Solid State Relays SSR(STD+1A) (400V 0.1A)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 2000
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General Purpose, Form A, Solid State Relay (Photo MOSFET), 400V/0.12A/25ohm,Solid State Relays SSR(GP+1A) (400V 0.1A)
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1 + 10 + 25 + 50 + >=100 -
在庫 : 1
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Low C x R, 1 Form A, Solid State Relay (Photo MOSFET), 400V/100Ω/15pF,Solid State Relays SSR(CR+1A) (400V 0.04A)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 10080
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General Purpose, Form A, Solid State Relay (Photo MOSFET)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 5232
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High Current, Solid State Relay (Photo MOSFET), 60V/1.0A/0.5ohm,Solid State Relays SSR(HC+1A) (60V 1.0A)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 490
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Standard, 1 Form A, Solid State Relay (Photo MOSFET), 60V/0.2A/10Ω,Solid State Relays SSR(STD+1A) (60V 0.2A)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 750
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Q:What defines the physical structure of SO-4?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB integration.
- Central thermal pad (70% coverage) for efficient heat dissipation.
- 4-pin layout with dual-row symmetric arrangement.
- 1.0 mm ultra-thin profile for space-constrained designs. -
Q:Why choose SO-4 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOT-23 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 2.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is SO-4 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Low-noise amplifiers (e.g., SKY67100).
- Sensor Interfaces: MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (≥4 vias, 0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.



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