SMD-8
- 商品画像 & モデル
- 備考
- 単価
- 量
- 動作して
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2 Form A (DPST-NO) 1.2V 40V 60mΩ 2.5A AC,DC SMD-8 Solid State Relays - MOS Output (PhotoMOS) ROHS
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 7143
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2 Form A (DPST-NO) 1.2V 600V 35Ω 80mA AC,DC SMD-8 Solid State Relays - MOS Output (PhotoMOS) ROHS
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 5723
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2 Form A (DPST-NO) 1.2V 400V 20Ω 130mA AC,DC SMD-8 Solid State Relays - MOS Output (PhotoMOS) ROHS
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 3683
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1 Form C (SPDT-NO, NC) 1.2V 400V 20Ω 120mA AC,DC SMD-8 Solid State Relays - MOS Output (PhotoMOS) ROHS
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 7635
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2 Form B (DPST-NC) 1.2V 400V 20Ω 120mA AC,DC SMD-8 Solid State Relays - MOS Output (PhotoMOS) ROHS
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 7832
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2 Form A (DPST-NO) 1.2V 350V 17Ω 130mA AC,DC SMD-8 Solid State Relays - MOS Output (PhotoMOS) ROHS
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 6419
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Slide Switches slide , 2 pole 3 cont., top set., gull wing, 2mm knob
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 6913
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Optocoupler Drive Push-Pull 1CH 30V 1500V 8Pin DIP SMD T/R
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 545
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Optocoupler Drive Push-Pull 1CH 30V 1500V 8Pin DIP SMD T/R
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 532
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VCNL4100 1000 mm Range 940 nm Distance Proximity and Ambient Light Sensor
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 2051
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Q:What defines the physical structure of SMD-8?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 8-pin layout with dual-row symmetrical arrangement.
- 1.0 mm ultra-thin profile for space-constrained designs. -
Q:Why choose SMD-8 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOIC-8.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL-3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0 × 3.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is SMD-8 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2541).
- Sensor Interfaces: MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.



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