SIP2
- 商品画像 & モデル
- 備考
- 単価
- 量
- 動作して
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Aluminum Electrolytic Radial Lead Hi Temp Capacitor; Capacitance: 2200uF; Voltage: 10V; Case Size: 12.5x25 mm; Packaging: Tape & Ammo
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 17000
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Motor / Motion / Ignition Controllers & Drivers 3-Phase Gate DRVR HVIC 600V 200mA
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 500
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Q:What defines the physical structure of SIP2?
A:Key features include:
- Leadless bottom-mounted pads: Ensures compact PCB footprint.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 8-pin layout with dual-row arrangement: Balances I/O density and space efficiency.
- 1.0 mm ultra-thin profile: Ideal for low-profile applications. -
Q:Why choose SIP2 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs for SIP2?
A:Standard configurations (consult datasheets):
- Body Size: 3.0 × 3.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is SIP2 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2640).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines for SIP2?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (ramp rate 2°C/sec).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).



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