すべてのカテゴリQFN 32
- 商品画像 & モデル
- 備考
- 単価
- 量
- 動作して
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IC SENSOR MAGN ANGLE POS 32QFN HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 1313
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IC ENCODER ROTARY 32QFN HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 4858
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IC HEADPHONE NOISE-CANCEL 32QFN HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 5969
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IC HEADPHONE NOISE-CANCEL 32QFN
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 1037
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Controller 32-Pin QFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 5000
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Programmable 360 degree Magnetic Angle Encoder with Absolute SSI and PWM Output
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 1000
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Programmable 360 degree Magnetic Angle Encoder with Buffered SINE and COSINE Output Signals
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 490
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その他の受動部品
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 8643
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集積回路（IC）
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1 + 10 + 25 + 50 + >=100 -
1
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Triple, 180∑ Out-of-Phase, Step-Down PWM and Single Linear Controller
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1 + 10 + 25 + 50 + >=100 -
1
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Pb Free. ISL9440B Highly Integrated Power controller 32 ld M HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 2811
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QFN Packaged, 【15kV ESD Protected, +2.7V to +5.5V, 10Nanoamp, 250kbps/ 1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown
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1 + 10 + 25 + 50 + >=100 -
1
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QFN Packaged, +/-15kV ESD Protected, +2.7V to +5.5V, 10Nanoamp, 250kbps, RS-232 Transmitters/Receivers
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1 + 10 + 25 + 50 + >=100 -
1
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QFN Packaged, +/-15kV ESD Protected, +2.7V to +5.5V, 10Nanoamp, 250kbps, RS-232 Transmitters/Receivers
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1 + 10 + 25 + 50 + >=100 -
1
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IC ENCODER PROG 32QFN HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 520
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Q:What defines the physical structure of QFN 32?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 32-pin layout with perimeter-only or dual-row pin arrangement.
- 0.9 mm ultra-thin profile for space-constrained designs. -
Q:Why choose QFN 32 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent SOIC packages.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5×5 mm (±0.1 mm tolerance).
- Height: 0.9 mm (max).
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is QFN 32 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., nRF52840).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under the central pad.
- Solder Paste: Type 4 (powder size 20–38 μm) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% void area).