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QFN-28

The QFN-28 (Quad Flat No-leads) is a surface-mount package designed for high-density circuits. Featuring a leadless design, an exposed thermal pad, and an ultra-thin profile, it delivers superior heat dissipation and reduced signal interference. Typical dimensions are a 5×5 mm body with a 0.5 mm pin pitch and a 1 mm height, making it ideal for power management ICs in portable devices, IoT sensor modules, and compact consumer electronics. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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