PLC
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TERMINAL COVER, FOR G9EA; Depth, external:36mm; Length / Height, external:21mm; Series:G9EA; Width, external:49mm RoHS Compliant: Yes,Relay Sockets & Hardware Terminal Cover for G9EA
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 1450
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Q:What defines the physical structure of PLC?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad: 80% coverage for efficient heat dissipation.
- 32-pin layout: Dual-row perimeter arrangement.
- Ultra-thin profile: 0.8 mm thickness for space-constrained designs. -
Q:Why choose PLC over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than QFN packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is PLC typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., 5G PA modules (e.g., QPA4501).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).



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