ホーム > 製品 > MSOP-16

MSOP-16

The MSOP-16 (Mini Small Outline Package, 16-terminal) is a surface-mount package designed for high-density circuits. Featuring an ultra-compact footprint, an exposed thermal pad, and gull-wing leads, it delivers significant space savings and enhanced thermal dissipation. Typical dimensions are 3×4 mm with a 0.5 mm pin pitch and a 1.1 mm profile height, making it ideal for portable electronics, power management ICs, and compact sensor modules. Its exposed pad design enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
  • 商品画像 & モデル
  • 備考
  • 単価
  • 動作して
  • SI4020
  • SI4020 Hot Sale

    メーカー: SILICON

    パッケージ: MSOP-16

  • Fully integrated (Iow BOM, easy design-in) No alignment required in production Fast settling, programmable, high-resolution PLL
  • 1 +
    10 +
    25 +
    50 +
    >=100
  • 最小数 : 1 在庫 : 6800