12-UFBGA, WLCSP
- 商品画像 & モデル
- 備考
- 単価
- 量
- 動作して
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ANALOG DEVICES AD5665RBCBZ-1-RL7 Digital to Analogue Converter, Quad, 16Bit, Serial, 2.7V to 5.5V, WLCSP, 12Pins
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 690
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ANALOG DEVICES AD5664RBCBZ-3-RL7 Digital to Analogue Converter, Quad, 16Bit, 223KSPS, Serial, 2.7V to 3.6V, WLCSP, 12Pins
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1 + 10 + 25 + 50 + >=100 -
在庫 : 1
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USB Interface, Single Port Power Switch, 3.2 V, 17.5 V, WLCSP, 12 Pins
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 251
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Conv DC-DC 2.5V to 4.5V Step Up Single-Out 5.929V to 5.508V 0.05A 12Pin UCSP50L1C T/R
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 3000
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USB Interface, USB Type-C and Power Delivery (PD) Controller, 2.5 V, 5.5 V, WLCSP, 12 Pins
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 97
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IC LED Driver DC DC Regulator 25mA Backlight 12-WLCSP (1.7x1.4)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 331
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IC LED Driver DC DC Regulator PWM Dimming 25mA Backlight 12-WLCSP (1.7x1.4)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 538
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IC LED Driver DC DC Regulator PWM Dimming 25mA Backlight 12-WLCSP (1.7x1.4)
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 309
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Multiplexer/Demultiplexer Bus Switch 1Element 8IN 16Pin TSSOP
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 2901
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USB Interface, USB Type-C Audio Switch, USB 2.0, 2.7 V, 5.5 V, WLCSP, 12 Pins
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 565
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0402 4.7nF ±10% 50V X7R, Cap Ceramic 0.0047uF 10% SMD 125C 4700pF SMT
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 747
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NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 32M-bit 4M x 8 6ns 12-Pin WLCSP T/R
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 3307
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Power Load Switch, High Side, Active Low, AEC-Q100, 1 Output, 3.3 V, 3 A, 0.062 ohm, WLCSP-12
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 2905
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Level Translator, Transceiver, 4 Inputs, 5.8ns, 2.3V to 5.5V, WLCSP-12
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1 + 10 + 25 + 50 + >=100 -
最小数 : 1 在庫 : 10000
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Q:What defines the physical structure of 12-UFBGA (WLCSP)?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity without protruding leads.
- Central thermal pad: Provides ~60% substrate coverage for enhanced heat dissipation.
- 12-pin layout: Arranged in a 3×4 grid pattern for compact routing.
- Ultra-thin profile: 0.5 mm height, ideal for space-constrained designs. -
Q:Why choose 12-UFBGA (WLCSP) over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent QFN packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance (<0.5 nH) design for high-frequency applications.
- Reliability: Moisture-resistant (MSL3-rated) substrate and halogen-free materials. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 1.6 mm
- Height: 0.5 mm
- Pin Pitch: 0.4 mm
- Material: Copper-alloy pads with solder mask-defined (SMD) openings.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 12-UFBGA (WLCSP) typically applied?
A:Dominant use cases:
- IoT Sensors: e.g., TI’s HDC2010 humidity/temperature sensor.
- Wearable Electronics: e.g., STM32L4 ultra-low-power MCUs.
- RF Modules: e.g., Nordic nRF52840 BLE/Wi-Fi combos. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 4×4 thermal via arrays under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 µm particle size) for precise deposition.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process, ramp rate 2°C/sec).
- Inspection: X-ray (AXI) mandatory due to hidden solder joints.



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