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12-UFBGA, WLCSP

The 12-UFBGA and WLCSP (12-Ultra Fine Pitch Ball Grid Array and Wafer Level Chip Scale Package) is a surface-mount package designed for high-density and miniaturized circuits. Featuring leadless design, fine ball pitch, and ultra-thin profile, it delivers compact size, superior heat dissipation, and reduced signal inductance. Typical dimensions are 2.0×2.0 mm with a height of 0.6 mm and a 0.4 mm pin pitch, making it ideal for portable devices, IoT sensors, and power management ICs. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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